XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone / Qualcomm / MTK / Hisilicon
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Seller: Martview Shenzhen
ID: MV-230510F492S8
Weight: 0.02 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
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only Stencil for Qualcomm
only Stencil for MTK
only Stencil for Hisilicon
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Description
XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone / Qualcomm / MTK / Hisilicon
Features:
- Adopt new magnetic power positioning, strong magnetic force clamping firm, automatic alignment
- Built-in powerful magnets, strong adsorption, no snaps, easy to pick up, fast maintenance work
- Easy to operate stable clamping, put in the chip, automatic clamping, flexible pull full
- The base is made of synthetic stone, green and environmentally friendly, with high-temperature resistance, high strength, dirt resistance, easy to clean characteristics
- Tin-planting table using environmentally friendly rubber feet, with wear-resistant anti-skid, shock absorption, anti-pressure, anti-aging, non-toxic, tasteless, and high-temperature resistance, etc
Support model:
- Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
- MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
- Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
- iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16
Package includes:
- 1 x Tin Planting Platform
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