XZZ TR17 4-in-1 Middle Layer BGA Reballing Stencil Platform for iPhone 17 / 17 Pro / 17Pro Max / 17 Air
0 out of 5 stars
No review yetReady stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-25102157B4H9
Weight: 0.15 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
| 10 | NaN | -8.6% |
Product details
Description
XZZ TR17 4-in-1 Middle Layer BGA Reballing Stencil Platform for iPhone 17 / 17 Pro / 17Pro Max / 17 Air
The Motherboard shown in the image is for reference only. The actual package does not contain any Motherboard!!!
Step-by-step demonstration:
- Put the tinning table into the magnetic base, and fix the motherboard that needs to be tinned in the corresponding slot of the tinning table
- Please take out the corresponding tinning stencil and place it in the tinning table to align with the lamination
- Use the tin scraper to apply the solder paste evenly in the mesh of the tinning net
- Remove the stencil, and then use a hot air gun to heat and blow until the solder paste melts
Package includes:
- 1 x Positioning Plate
- 4 x Stencil
Customer reviews
0.0/ 5.0
0
0
0
0
0
