YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair

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Seller: Martview Shenzhen

ID: MV-241012T5AS64

Weight: 0.30 kg

Qty	Price	Discount
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3	NaN	-2.4%
5	NaN	-4.8%
10	NaN Wholesale Price	-7.1%

Product details

YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair

Features:
Larger size, more clamping space, fully applicable to various types of chips/motherboards
Removal of tin and glue, no need to adjust the direction, travel coaxial movement
For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
Motherboard cleaning doesn't require adjusting the orientation, clean up at once
The module is suitable for various sizes of motherboards in all aspects

Package includes:
1 x Fixture