YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
0 out of 5 stars
No review yetReady stock
NaN
As low as NaN
Worldwide shipping
Seller: Martview Shenzhen
ID: MV-241012T5AS64
Weight: 0.30 kg
| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.4% |
| 5 | NaN | -4.8% |
| 10 | NaN | -7.1% |
Product details
Description
YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
Features:
- Larger size, more clamping space, fully applicable to various types of chips/motherboards
- Removal of tin and glue, no need to adjust the direction, travel coaxial movement
- For iPhone / Android full series IC chip, removal of glue/tin Not blocking the knife
- Motherboard cleaning doesn't require adjusting the orientation, clean up at once
- The module is suitable for various sizes of motherboards in all aspects
Package includes:
- 1 x Fixture
Customer reviews
0.0/ 5.0
0
0
0
0
0
