YCS Mini U-Protection Universal BGA Reballing Planting Tin Platform
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Seller: Martview Shenzhen
ID: MV-2509023MPD4S
Weight: 0.15 kg
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| 3 | NaN | -2.4% |
| 5 | NaN | -4.8% |
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Product details
Description
YCS Mini U-Protection Universal BGA Reballing Planting Tin Platform
Features:
- Secure clamping for versatile use with a wider range of IC components, including CPUs, hard drives, and font libraries
- Anti-slip rubber feet design ensures wear resistance and enhanced stability, facilitating easier maintenance
- Easy to remove specialized groove design, both sides are designed with special grooves for removing, a thoughtful experience
- Ultra-strong magnetic force, precise fit without peeling off, self-contained precise positioning, and aligning the holes is more convenient
Package includes:
- 1 x Platform
Customer reviews
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