YCS Multi-Specification Precision BGA Reballing Leaded Solder Balls for Motherboard Repair

YCS Multi-Specification Precision BGA Reballing Leaded Solder Balls for Motherboard Repair

Features:

• Wide range of applications, used for computer motherboard repairs, various PCB production, chip soldering, etc

• Uniform size of solder balls, no defects on the ball diameter surface, smooth and shiny

• Various specifications, available for selection, various specifications from 0.3 to 0.55mm available for your diverse needs

• Small spherical tin-based electronic components that connect semiconductor chips. circuit templates, and PCB boards, and transmit electronic signals

• High yield production, single ball diameter with strictly controlled diameter tolerance, and an internally controlled tolerance of only 8 micrometers

• The larger the model, the larger the particles; Conversely, the smaller the model, the smaller the particles. They are packed in bottles with the same quantity of 25000 pieces, but the bottle appears emptier for smaller sizes

Package includes:

• 25000 x BGA Solder Balls (0.55mm is 10000Pcs)