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YCS TH02 Spring Repair Fixture for Mobile Phone Motherboard & CPU Chip Repair

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ID: MV-2608149P5M66
Weight: 0.40 kg
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Product details

Description

YCS TH02 Spring Repair Fixture for Mobile Phone Motherboard & CPU Chip Repair

Features:
  • Rebound Locking Design: Spring-loaded mechanism auto-locks the motherboard/CPU in place. No more slipping or shifting—ensures precise, secure clamping for delicate components.
  • Tight Clamping for Efficiency: Ergonomic blue clamping plate with optimized grip. Holds devices firmly during repair, reducing errors and improving workflow.
  • High-Temperature Resistant: Built with heat-resistant synthetic stone. Withstands high temperatures from heat guns/hot air stations without warping or damaging the motherboard.
  • Anti-Slip Metal Base: Sturdy metal base with silicone anti-slip strips. Prevents movement during use—ensures stability even with repeated heating/cooling cycles.

Package includes:
  • 1 x Fixture 
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ycs th02-spring-repair-fixture-for-mobile-phone-motherboard-cpu-chip-repair-4
ycs th02-spring-repair-fixture-for-mobile-phone-motherboard-cpu-chip-repair-5
ycs th02-spring-repair-fixture-for-mobile-phone-motherboard-cpu-chip-repair-6
ycs th02-spring-repair-fixture-for-mobile-phone-motherboard-cpu-chip-repair-7
ycs th02-spring-repair-fixture-for-mobile-phone-motherboard-cpu-chip-repair-8

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