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YiHua 1000A IR Soldering Station BGA Rework Station

YiHua 1000A IR Soldering Station BGA Rework Station

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ID: MV-210108SDC48K
Weight: 12.00 kg
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Description

YiHua 1000A IR Soldering Station BGA Rework Station

Feature
  • Using the new Samsung microcomputer processor PID programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.
  • Adopt infrared weld technology which independent exploration, infrared penetration strength , components uniform heating, beyond the traditional hot air heating, vowed to prevent blow off the IC surrounding small components.
  • Technician focused infrared heat is easy to target most component removal/replacement and re-work.
  • Infrared heat source bulbs are long-lived, un-expensive, and easily replaced.
  • Has bright delicate, low voltage LED lighting, safety, and energy conservation
  • It has an External Sensor Temperature control mode, which is detected by the sensor IC surface temperature control temperature, this function is good for freshman operation , it’s a safe way to protect components.
  • MountTechnology (SMT) components 15-35cm in size.
  • This machine has 540W heating system , widely to 120mm*120mm.
  • The preheating plate color is black , from the point point of view , black color easy to absorb heating , shorten the warm-up time.
  • Temperature correction function Correction of temperature range -50°C~+50 °C ( Infrared lamp analog value 580 ).
  • Celsius / Fahrenheit temperature display function
  • This machine also has a soldering iron function, if you have the device, you can used for all of the components solder, desoldering, preheating, repair all components , especially Micro BGA components.  
  • Voltage  AC 220V / 110V to choose
  • Max power consumption 715W
  • Suitable for de-soldering and soldering BGA, SOIC, CHIP, QFP, PLCC package SMD IC, Particularly suitable for desoldering BGA module, computer motherboard north and southbridge,  all kinds of mobile phone motherboard SMT IC and LED lights.
  • Shrinking, Paint drying, adhesive removal, thawing, warming, Plastic welding, etc.

Preheating station parts:
  • Max power consumption 540W 
  • Light-emitting components Far infrared heating plate
  • Temperature Range 50°C-200°C
  • Display Type LED
  • Preheating area 120*120mm

Infrared lamp part
  • Max power consumption 150W
  • Light-emitting components Infrared emission lamp
  • Temperature Range 100°C-350°C / 212°F~662°F
  • Temperature Stability ±1°C
  • Display Type LED
  • Effective irradiation area 35*35mm
  • Come with 2 lens cup

Soldering station part
  • Max power consumption 75W
  • Heating components imported heater
  • Temperature Range 200°C-480°C / 392°F~896°F
  • Temperature Stability ±1°C ( statics ) 
  • Tip of ground voltage <2mV
  • Tip ground impedance <2 ohm
  • Display Type LED Display
  • Handle cable length ≥100cm

NOTICE
  • To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components, like Plastic, Display, Phone camera, LED, Electrolytic capacitors.
  • Ensure that no combustible fusible explosive components in Infrared light can shine on the area, If you can not avoid it, Must use reflective paper to keep out that. like Plastic, Display, Phone camera, LED, Electrolytic capacitors.
  • According to IC size, use a suitable diameter lamp cup ( lamp cup size larger than IC size ); Install lights
  • Cup minimizes the distance between lamp and IC, to facilitates heating.
  •  Ensure that the working environment is no greater airflow to prevent heat loss, well-sheltered measures when necessary.
  • Apply solder paste to the IC before the de-soldering, also you can early preheat then Apply solder paste,
  • Especially BGA package IC should be early preheated then apply solder paste, the can make solder paste penetrate into the bottom of the IC.
  • Wear heat-protective gloves and goggles. Place the visor, good shading measures to protect the eyes.
  • Turn on the Infrared light power, set the temperature to about 280°C. Make the appropriate adjustments based on the size of the IC and circuit board. IC by infrared light irradiation will be rapidly warming ( generally 1 to 3 minutes).
  • Just started using this product, it is best to try to use the abandoned circuit board rework a few times. and so familiar with the use of this product, then carry out normal maintenance work.

Package includes:
1 x Yihua 1000A IR Station
1 x Solder Handle
1 x Solder Holder
1 x Power Cable

YiHua 1000A IR Soldering Station BGA Rework Station
YiHua 1000A IR Soldering Station BGA Rework Station

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